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Core Competencies

Manufacturing Capability

Integrated Solution

A Complete Manufacturing Solution, Under One Roof

We offer vertically integrated manufacturing capabilities, supported by end-to-end process design and strict control across every production loop.

Our facilities are equipped with a wide range of advanced manufacturing technologies, including SMT, PCBA, COB, automated assembly, ultrasonic welding, potting, conformal coating, wire harness assembly, box build, and product aging. All production equipment is seamlessly connected to our Manufacturing Execution System (MES), enabling full-process traceability, real-time monitoring, and effective quality management.

We support RoHS compliant manufacturing processes, while also accommodating traditional process requirements when needed. Our manufacturing model is optimized to support both low-volume, high-mix (LVHM) and high-volume, low-mix (HVLM) production environments, ensuring scalability, process repeatability, and consistent product quality across varying demand profiles.

Process design and analysis are conducted according to customer requirements, using BRIO manufacturing standards to ensure standardization, manufacturability, and traceability across every production run.

Design for Excellence

We Review and Optimize Your Design Before Production

DFM

Design for Manufacturing

DFA

Design for Assembly

DFT

Design for Testability

DFR

Design for Reliability

Products are manufactured in accordance with international standards, including IPC J-STD-001 and IPC-A-610.

Capability

High-Standard Manufacturing Capability

Across surface mount, assembly, and test, here is what BRIO can build for you.

Need the full equipment list? Talk to our team for a detailed capability sheet.

Surface Mounted Technology

High-speed placement down to 01005, with inspection before and after reflow so defects are caught on the line.

  • Screen Printing (solder paste and adhesive, using laser-cut or stepped stencils)
  • Nitrogen (N2) Reflow / Air Reflow
  • Inline 3D Solder Paste Inspection (SPI)
  • Pin-in-Paste Process
  • Online Automatic Glue Dispensing
  • Package-on-Package (PoP) Placement Process
  • NPM-Series Pick-and-Place Systems (capable of handling 01005 package components)
  • Inline Automated Optical Inspection (AOI) - SMT

PCBA and Box Build

From bare board to finished product: through-hole, protection, harnesses, enclosure, firmware, and full traceability.

  • Customized Component Lead Forming (Pre-Processing)
  • Manual Through-Hole Insertion
  • Wave Soldering
  • PCBA Depanelization (routing, punching, V-cut)
  • Robotic Welding
  • Pulse Hot Bar Welding
  • Ultrasonic Welding (USW)
  • Press-Fit Assembly

Product Testing

Every board ships with its own test record - function verified, hidden joints confirmed, reliability proven.

  • In-Circuit Testing (ICT)
  • Burn-In and Product Aging Tests
  • System-Level Testing
  • Screen Printing (solder paste and adhesive, using laser-cut or stepped stencils)
  • Burn-In and Aging
  • Functional Testing (FCT)
  • Environmental and Reliability Testing
  • Routine Electrical Testing (high voltage test, insulation resistance test, leakage current test, impedance test)
Packaging

Structural Components & Packaging Material Customization

We provide a wide range of structural solutions, including plastic injection molding, aluminum extrusion and die casting, sheet metal fabrication, CNC machining, and related services. Through vertically integrating supply chain resources, we deliver comprehensive, one-stop manufacturing solutions to meet diverse customer requirements for both structural components and packaging materials.

Warehousing

Intelligent Warehouse Management

We implement intelligent racking systems within dedicated warehouse zones to ensure effective FIFO control of raw materials. Through standardized management, inventory and data are fully integrated to enable real-time material visibility and traceability.

In addition to raw material management, we provide turnkey delivery services, including both direct and drop shipping to distribution channels or end customers. This approach ensures efficient end-to-end logistics and closed-loop Supply Chain Management.