BRIO | Quick-Turn PCBA

Built for Speed and Flexibility

Dedicated R&D Prototype Line:independently operated for rapid prototyping and engineering validation.
No MOQ:supporting prototypes, pilot runs, and low-volume production.
Dedicated Engineering Team:supporting diverse product and industry requirements.
R&D Quick-Turn:shortening development cycles and time-to-market.
Full-Capability Assembly:SMT, THT, testing, and conformal coating.
Flexible Delivery:adaptable to changing schedules and production volumes.
On-Site Workspace:enabling real-time production visibility and collaboration.

DFM System: Proprietary DFM evaluation system enabling more robust and scalable mass production
>30%: Reduced R&D Cycle Time
>80%: Fewer defects - Reduction in Manufacturing Defects

Category	Specifications
PCB Types	Single-Sided, Double-Sided, and Multilayer PCBs
Supported Package Types	QFP, LGA, BGA (up to 100 x 100 mm, min. pitch 0.35 mm, up to 10,000 balls), PoP, PBGA, and CSP \| Minimum Placement Size: 01005 and 0201
Board Size	Min 50 x 50 mm \| Max 510 x 460 mm (750 x 550 mm)
Manufacturing Processes	10-Zone Nitrogen Reflow, Wave & Selective Soldering, Robotic Soldering, Press-Fit Assembly, Conformal Coating, and Potting
Equipment	Panasonic SMT Production Lines, 3D SPI, AOI, Smart FAI, ICT, and Dual-Camera AOI
One-Stop Procurement	Full BOM Sourcing & Component Selection \| Localized Component Alternatives Available